The capabilities of IBEX materials identification technology have been demonstrated on multi-layer printed circuit boards, enabling the operator to check where copper tracks and planes are present, and where they overlap.
Having trained the system on material with known copper thicknesses, the features on the X-ray image have been classified according to their thickness. A line profile reveals the measured copper thicknesses.
Click through the images in the image pane to see another example in more detail.
The data were collected at 120 kV using a tungsten target microsource X-ray tube.